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Lab Procedures
 

Aqua Bond Laboratory Services

Analytical Procedure Development
Coating Weight
Hull Cell Test
Humidity Test (ASTM D2247)
Infrared Spectroscopy Scans (FTIR)
Ion Chromatography (IC)
Liquid Chromatography (HPLC)
Metallic Impurities
pH
Plating and Surface Finishing Bath Analysis
Plating Bath Conversion
Plating Bath Troubleshoot
Salt Spray Test (ASTM B227)
Solid Content
Surface Tension
Viscosity

Water Analysis
Aluminum
Chloride
Chromium
Chromium (Hexavalent)
Cobalt
Copper
Fluoride
Iron
Lead
Manganese
Nickel
Nitrate
pH
Phosphates (Orthophosphate, Organic Phosphate, Meta Phosphate, or Total Phosphate)
Phosphorus
Silver
Tin
Total Dissolved Solids (TDS)
Total Suspended Solids (TSS)
Zinc

Resin
Aging
Density
Saponification
Refractive Index
Total Acid Number
Viscosity

 

 

Plating/Surface Finishing

Acid Pickling/Activator Solution
Acid Concentration
Aluminum Deoxidizer Solution
Deoxidizer Concentration

Chromium (Hexavalent) Plating Solution
Catalyst
Chloride
Chromic Acid
Chromic Acid to Sulfate Ratio
Efficiency test
Fluoride
Sulfate
Surface Tension
Trivalent Chromium

Chromium (Trivalent) Plating Solution
Boric Acid
pH
Trivalent Chromium Catalyst
Trivalent Chromium Metal
Specific Gravity
Surface Tension

Chromium (Hex/Trivalent) Solution for electroplated zinc coatings
Hex/Trivalent Concentration
pH

Cleaning Solution
Concentrations
Life Index
Oil Split
Surfactant

Copper (Acid) Plating Solution
Chloride
Copper Sulfate
Sulfuric Acid

Corrosion Preventives / Sealers
Concentration
pH

Nickel (Black) Plating Solution
Salt and Additive Concentrations
pH

Nickel (Bright/Semi) Plating Solution
Additive Concentrations
Boric Acid
Nickel Chloride
Nickel Metal
Nickel Sulfate or Sulfamate
pH
Specific Gravity

Nickel (Electroless) Plating Solution
Nickel Metal
pH
Sodium Hypophosphite
Sodium Orthophosphite
Teflon Concentration
Oxide (Brown/Black) Finish Solution
Oxidizer Concentration
Sodium Hydroxide
Stripping Solution
Concentration
pH

 

Nickel (Electroless) Plating Solution
Nickel Metal
pH
Sodium Hypophosphite
Sodium Orthophosphite
Teflon Concentration
Oxide (Brown/Black) Finish Solution
Oxidizer Concentration
Sodium Hydroxide
Stripping Solution
Concentration
pH

Tin (Acid) Plating Solution
Additive Concentrations
Chloride
Non-fluoboric or Methane Sulfonic Acid or Sulfuric
Stannous Tin
Total Tin

Tin (Alkaline) Plating Solution
Sodium (Potassium) Hydroxide
Tin

Tin-Lead Plating Solution
Additive Concentrations
Lead
Non-fluoboric or Methane Sulfonic Acid or Sulfuric
Stannous Tin
Total Tin

Tin-Zinc Plating Solution
Additive Concentrations
pH
Stannic Tin
Stannous Tin
Tin/Zinc Ratio
Zinc Metal

Zinc (Acid) Plating Solution
Additive Concentrations
Ammonium Chloride or Boric Acid
Cloud Point
Efficiency test
pH
Potassium Chloride
Total Chloride
Zinc Metal

Zinc (Alkaline) Plating Solution
Additive Concentrations
Carbonate
Distribution Ratio
Sodium Hydroxide
Zinc Metal

Zinc-Nickel Plating Solution
Nickel Metal
pH
Total Chloride
Zinc Metal

Zinc Phosphate Solution
Aluminum
Free Acid
Iron
Total Acid
Zincate Solution

Above is a list of the most common analytical procedures for plating and surface finishing solutions performed at Aqua Bond. Please contact us if there are specific tests you are interested in that are not listed. If you are interested in expanding your own laboratory, we additionally offer test method development, as well as laboratory technique and instrumentation training.
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